Iriburiro: Ibibazo bya tekiniki muri Automotive Electronics naUdushya twa Capel

Mugihe ibinyabiziga byigenga bigenda byerekeza kuri L5 kandi sisitemu yo gucunga batiri (EV) ikoresha amashanyarazi (BMS) isaba ingufu nyinshi n’umutekano, tekinoroji gakondo ya PCB irwana no gukemura ibibazo bikomeye:

• Ibyago byo guhunga ubushyuhe: Chipets ya ECU irenga 80W ikoresha ingufu, hamwe nubushyuhe bwaho bugera kuri 150 ° C.
• Imipaka ya 3D yo Kwishyira hamwe: BMS isaba imiyoboro yerekana ibimenyetso 256+ muburebure bwa 0.6mm
• Kunanirwa kunyeganyega: Ibyuma byigenga bigomba kwihanganira 20G imashini
• Miniaturisation irasaba: Abagenzuzi ba LiDAR bakeneye ubugari bwa 0.03mm hamwe nuburinganire bwa 32

Ubuhanga bwa Capel, bukoresha imyaka 15 ya R&D, butangiza igisubizo gihinduka gihuzaamashanyarazi menshi ya PCBs(2.0W / mK),PCBs irwanya ubushyuhe bwinshi(-55 ° C ~ 260 ° C), na32HDI yashyinguwe / impumyi ikoresheje ikoranabuhanga(0.075mm microvias).

Igice cya 1: Impinduramatwara yo gucunga ubushyuhe bwa ECUs yigenga

1.1 Ibibazo by'ubushyuhe bwa ECU

• Nvidia Orin chipset ubushyuhe bwuzuye: 120W / cm²
• Ubusanzwe FR-4 substrates (0.3W / mK) itera ubushyuhe bwa 35% chip ihuza ubushyuhe bukabije
• 62% bya ECU byananiranye bituruka kumyuka yubushyuhe iterwa numunaniro wumucuruzi

1.2 Tekinoroji ya Optimisiyoneri ya Capel

Udushya twinshi:

• Nano-alumina yashimangiye insimburangingo ya polyimide (2.0 ± 0.2W / mK ubushyuhe bwumuriro)
• Inkingi ya 3D y'umuringa (400% yiyongereyeho ubushyuhe bwo gukwirakwiza)

Inzira ziterambere:

• Laser Direct Structuring (LDS) kugirango inzira nziza yubushyuhe
• Guteranya Hybrid: 0.15mm ultra-thin umuringa + 2oz umuringa uremereye

Kugereranya imikorere:

Igice cya 2: Impinduramatwara ya BMS hamwe na tekinoroji ya 32-ya HDI

2.1 Ingingo zibabaza inganda muburyo bwa BMS

• 800V platform isaba imiyoboro ya 256+ yo kugenzura voltage
• Ibishushanyo bisanzwe birenga imipaka ya 200% hamwe na 15% bidahuye

2.2 Ibisubizo bya Capel-Ubucucike Bwinshi Bwihuza

Ubwubatsi bwa Stackup:

• 1 + N + 1 urwego rwose rwa HDI (ibice 32 kuri 0.035mm z'ubugari)
• Control 5% igenzura itandukaniro (10Gbps yihuta cyane)

Ikoranabuhanga rya Microvia:

• 0.075mm ya laser-impumyi (12: 1 igereranyo)
• <5% igipimo cyo guta agaciro (IPC-6012B Icyiciro cya 3 cyujuje)

Ibipimo ngenderwaho:

Igice cya 3: Ibidukikije bikabije kwizerwa - MIL-SPEC Yemejwe Ibisubizo

3.1 Imikorere Yubushyuhe bwo hejuru

• Ikirahure cyinzibacyuho (Tg): 280 ° C (IPC-TM-650 2.4.24C)
• Ubushuhe bwo kubora (Td): 385 ° C (gutakaza ibiro 5%)
• Kurokoka Ubushyuhe bukabije: Inzinguzingo 1.000 (-55 ° C↔260 ° C)

3.2 Ikoranabuhanga ryo Kurinda Umutungo

• Plasma-yashizwemo na polymer (1.000h irwanya umunyu)
• 3D EMI ikingira imyenge (60dB attenuation @ 10GHz)

Igice cya 4: Kwiga Ikibazo - Ubufatanye na Global Top 3 EV OEM

4.1 800V Module yo kugenzura BMS

• Ikibazo: Huza 512-umuyoboro AFE mumwanya wa 85 × 60mm
• Igisubizo:
  1. 20-layer rigid-flex PCB (radiyo 3mm igoramye)
  2. Umuyoboro wubushyuhe wubushyuhe (0.03mm yubugari)
  3. Gukonjesha ibyuma-byibanze bikonje (0.15 ° C · cm² / W birwanya ubushyuhe)

4.2 L4 Umugenzuzi wigenga

• Ibisubizo:
  • Kugabanya ingufu 40% (72W → 43W)
  • Kugabanya ingano ya 66% nibishushanyo bisanzwe
  • Icyemezo cyumutekano wa ASIL-D

Igice cya 5: Impamyabumenyi hamwe nubwishingizi bufite ireme

Sisitemu nziza ya Capel irenze ibipimo byimodoka:

• Icyemezo cya MIL-SPEC: Yubahiriza GJB 9001C-2017
• Kwubahiriza ibinyabiziga: IATF 16949: 2016 + Kwemeza AEC-Q200
• Ikizamini cyo kwizerwa:
  • 1.000h HAST (130 ° C / 85% RH)
  • 50G ihungabana ryimashini (MIL-STD-883H)

Umwanzuro: Ibikurikira-Gen PCB Ikoranabuhanga

Capel ni umupayiniya:

• Ibyinjijwemo passiyo (30% yo kuzigama umwanya)
• Optoelectronic Hybrid PCBs (0.2dB / cm gutakaza @ 850nm)
• Sisitemu ya DFM ikoreshwa na AI (kuzamura umusaruro wa 15%)

Menyesha itsinda ryacu ryubwubatsiuyumunsi kugirango dufatanyirize hamwe PCB ibisubizo byihariye bya elegitoroniki ikurikira.